Thanks for your time and assistance. It is greatly appreciated! Regards, Kevin Frasier Scientific Atlanta Atlanta, GA http://www.sciatl.com ______________________________ Reply Separator _________________________________ Subject: FW: Stencil Printing Adhesive (for bottom side SMT) Author: [log in to unmask] at PMDF Date: 2/28/96 10:51 AM ---------- From: Yuen, Michael To: 'Technet' Subject: FW: Stencil Printing Adhesive (for bottom side SMT) Date: Wednesday, February 28, 1996 8:20AM Priority: High Yes. I have had some success in the past working with a lactate adhesive. Major problem Included clean up and curing in the stencil apertures. Since January I have been working with MPM Corp. They have done a lot of work and research into printing adhesives. I feel they have solved the major problems I experienced with adhesives. Currently I am starting on some new adhesive process. The material I will be using is from Grace Specialty Polymers called Amicon D 125 f 5. Printer parameters are similar to that of printing paste. Rosenthal, Ed Process Engineer EAC [log in to unmask] ---------- From: TechNet-request To: TechNet Subject: Stencil Printing Adhesive (for bottom side SMT) Date: Tuesday, February 27, 1996 3:14PM To Whom It May Concern: Has anyone had any experience stencil printing adhesive for bottom side chip components in a medium to high volume facility? We are looking at some very large quantities of chip components on the bottom side of the boards and the present dispensing equipment will not be able to keep up with the component placement rate. If so: what is a recommended adhesive formulation? what are some recommended squeegee print speed and pressures? what are associated areas of risk stencil printing adhesive? Thank you for your time and consideration. Regards, Kevin Frasier