We've tried to qualify (J-STD-001A, NAWC MT-0002, or MIL-STD-2000B) a low 
solids flux in a no-clean process (for hand soldered assemblies which cannot be 
subjected to our in-line aqueous cleaner) with no success.  It seems that the 
excess flux which is not directly subjected to the heat of the soldering iron 
caused the test board (IPC-B-36) to fail SIR, no matter how we tried to limit 
the volume of flux deposited.  

We had to revert back to RMA flux for these instances and hand clean with an 
IPA blend.  

Jim Marsico
(516) 595-5879
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