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Subject:	Re: Tin-lead plating thickness
From:	David Bergman <[log in to unmask]>
Date:	Wed, 25 Sep 1996 09:09:15 -0500 (CDT)
Content-Type:	TEXT/PLAIN
Parts/Attachments:	TEXT/PLAIN (47 lines)

IPC-RB-276 does not require thickness measurement for fused tin-lead 
plating or HASL coating.  Solderability requirements are the only issue 
addressed.  If you have major planarity problems, you may want to 
consider alternative platings/finishes.  I have heard of some companies 
delivering very thin unfused tin-lead for some customers trying to deal 
with the flatness issue.  

Regards
Dave Bergman, IPC

On 25 Sep 1996 [log in to unmask] wrote:

> Does anybody know what is the tin-lead HASL plating thickness requirements 
> for printed circuit boards?   Do you have any standards which specified it? 
>  IPC-A-600D specified only the minimum plating thickness,  which is 0.005mm 
> or 0.0002" for our application.
> We are having a problem with  the circuit board which plating thickens is 
> greater than the other ones.   Also,  the plating surface is not  flat.  
> This is not the fine pitch components board.  But,  when pads are so 
> "bumpy" and plating is thicker than other boards,  the adhesive dots 
> application  becomes difficult.   Glue dispenser shall be adjusted for the 
> proper adhesive dots size.
> It would be greatly appreciated if anyone could give me any directions.
> 
> 
>  
> 
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