In our switch to a low solids no-clean, we are having problems with 
terminal solderability.  I know from my reading that this is a problem 
thoughout industry.  ASTM spec. #B545-92 gives excellent criteria for 
different classes.  Ours being class three, we spedify the base material, a 
barrier layer; 50microinches of nickle and final plating; 320 microinches 
of tin or tin/lead(12%max lead).  Terminals thus far with this 
specification have performed great.  However, previous designed terminals 
have only required the terminal to be solderable.  We are having a 
difficult time finding suppliers who will sign-up to the solderablity 
specification(dip test).  We were lucky for many years because we used a 
strong OA flux, and were able to solder terminals that were substandard.  
We are an automotive supplier and the terminals in question are individual 
terminals autoinserted into boards or terminals that are part of a 
connector.

My questions:
--Is anyone else having this problem and how are you handling it?
--I have heard that there are some changes being made to the J-standards 
specific to terminal solderablity
--Does anyone have any suggestions?

Thanks for your assistance

Ed Holton
Sr. Manufacturing Engineer
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