Gregg,

We have had great success with dummy parts, including BGAs from
TopLine (310) 433-7000.  We use them to characterize reflow profiles
for many of our boards, single and double-sided SMT/mixed.

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I am looking for sources of inexpensive plastic BGA225 "dummy" devices for 
process development.   We would like devices which we can electrically 
exercise to verify all internal connections, i.e.- bond wires up to a die. 
 (We're using the HP testjet system to check for open connections.)   Anyone 
with packaged devices which have defective die they want to sell?

We have little experience with plastic BGAs and are experiencing problems 
with opens and intermittent opens after reflow.  So far, the problems appear 
to be internal to the BGA devices themselves; the solder interconnects look 
good.  We suspect  package delamination but I haven't been able to 
definitively confirm this yet.   Any insights into the moisture sensitivity/ 
process temperature sensitivity of plastic BGAs?   We hear they can be more 
sensitive than "regular" plastic packages.

Any info appreciated.  TIA

Gregg Klawson
GTE Government Systems Corp
Taunton, MA, USA
telephone:  +1.508.880.1822, fax: +1.508.880.4316
email:  [log in to unmask]



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                                  Gary D. Peterson
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