Gregg, We have had great success with dummy parts, including BGAs from TopLine (310) 433-7000. We use them to characterize reflow profiles for many of our boards, single and double-sided SMT/mixed. ----- Begin Included Message ----- I am looking for sources of inexpensive plastic BGA225 "dummy" devices for process development. We would like devices which we can electrically exercise to verify all internal connections, i.e.- bond wires up to a die. (We're using the HP testjet system to check for open connections.) Anyone with packaged devices which have defective die they want to sell? We have little experience with plastic BGAs and are experiencing problems with opens and intermittent opens after reflow. So far, the problems appear to be internal to the BGA devices themselves; the solder interconnects look good. We suspect package delamination but I haven't been able to definitively confirm this yet. Any insights into the moisture sensitivity/ process temperature sensitivity of plastic BGAs? We hear they can be more sensitive than "regular" plastic packages. Any info appreciated. TIA Gregg Klawson GTE Government Systems Corp Taunton, MA, USA telephone: +1.508.880.1822, fax: +1.508.880.4316 email: [log in to unmask] ----- End Included Message ----- --- Gary D. Peterson _/_/_/ _/ _/ _/ SANDIA NATIONAL LABORATORIES _/_/_/ _/ _/_/ _/ _/ P.O. Box 5800, M/S 0503 _/_/ _/_/_/ _/ _/ _/ _/ Albuquerque, NM 87185-0503 _/_/_/_/_/_/ _/ _/ _/_/ _/ Phone: (505)844-6980 _/ _/_/ _/ _/_/_/ _/ _/ _/_/_/_/ FAX: (505)844-2925 _/ _/_/ _/ E-Mail: [log in to unmask] _/_/_/