TECHNET Archives

1996

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: GEN: Persulfate / Sulfuric Baths
From:
[log in to unmask]
Date:
Mon, 9 Dec 1996 00:12:13 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines) 
In a message dated 96-12-08 20:46:52 EST, you write:

>I'd like to hold a narrow etch rate window with fewer bath changes.
>
>

Likely the only way to do this is with a color controlled feed and bleed
apparatus.   Tell us where your microetch is in the process, and if it is
spray or immersion, and there may be some other ideas.

Best regards,

Rudy Sedlak
RD Chemical Company

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2