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1996

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Subject:
Die surface delamination
From:
"G.B.Vasanth" <[log in to unmask]>
Date:
Fri, 6 Sep 1996 13:04:49 -0500
Content-Type:
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I am studying a die surface problem in a IC package.  Will residual photoresist left on the surface of the die cause adhesion to the mold compound be affected.  Will this cause severe die surface delamination??  Any help would be appreciated.  

Thanks

Vasanth
214-778-6481

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