For CAF information see Engelmaier, W., and L. Turbini, "Design for
Reliability in Advanced Electronic Packaging," Proc. Surface Mount
International Conf., San Jose, CA, August 1995, pp. 844-879, which also
contains the most important references. The same information is included in
IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed
Board Assemblies'. 

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]  

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