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Date: | 11 Jun 1996 11:14:54 -0500 |
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Have seen a number of literature articles indicating the standard material
for a MCM-L is BT resin.
Question 1: Which laminate material suppliers make BT based resin laminates?
Question 2: With the advent of multifunctionals what properties still make
BT resin based laminates the preferred choice?.
Question 3: Do today's BT resin formulations still show the significant
shrink previously reported?
Question 4: Are there fabrication issues related to fine lines, feed
through holes or lamination that make BT resin based multichip module boards
more challenging to the fabricators and thus make them less cost effective
when compared to other resin systems of comparable glass transition
temperature?
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