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| Date: | Thu, 17 Oct 1996 14:30:39 -0500 |
| Content-Type: | multipart/mixed |
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The best test is to have the substrate supplier perform actual sample
wirebonding by lot in their facility to your process specifications and
provide pull and/or shear test results to you with each lot of
substrates. Many of the better suppliers already have this capability.
Phil Yates
Nextek, Inc.
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Jim Douglas wrote:
>
> Advice please !
> Is there a quantitative test that can be carried out on soft gold electroplate to qualify its suitability for wire bonding ?
> Gold thickness and purity already to customers spec.
> Note in this instance gold is on a nickel undercoat.
>
> Jim Douglas
> Kam Circuits
>
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