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1996

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Subject:
Tin/Lead to Straight Tin Plating
From:
John Parsons <[log in to unmask]>
Date:
Mon, 22 Apr 1996 11:17:20 -0700
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From:	John Parsons
	Circuit Graphics Ltd.

We are currently plating tin/lead at 15amp/sqft over copper to act as an etch resist.  We are looking to replace the SnPb with straight Sn.
1. What are the pros and cons of bright tin vs matt tin?
2. What is the recommended plating thickness or current/area?
3. Pros and cons of bar anode vs ball and basket?

Thank you in advance for your help.

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