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1996

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Subject:
From:
Jon Holmen <[log in to unmask]>
Date:
Mon, 26 Aug 1996 10:32:46 -0500 (CDT)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (59 lines)
The BGA section of the IPC-A-610 is at the early draft stages. The 
current plans are to issue all the new technology criteria together, so 
it will be at least a year before you'll see something. We do have the 
J-STD-013, "Implementation of Ball Grid Array and other High Density 
Technology"  which is the criteria that the 610 workmanship would follow.

****************************************************
Jon Holmen
Technical Project Manager
IPC
2215 Sanders Road
Northbrook IL  60062-6135
Phone (847) 509-9700 ex329
Fax   (847) 509-9798
e-mail  [log in to unmask]
URL:http://www.ipc.org
*****************************************************


On Thu, 22 Aug 1996 [log in to unmask] wrote:

> If I look at the back of IPC-A-610B Section 11, for BGAs is WIP.
> 
> I'm just wondering if there is a guess as to when that will be coming out.
> 
> In the meantime does anyone know of any "Industry" Workmanships
> Standards that are out there that I can use to evaluate BGA's.
> 
> Thanks.
> 
> A
> 
> Andy Heidelberg
> Micron Custom Manufacturing Services
> 8455 Westpark Street
> Boise, Idaho 83704
> 208-368-2784
> 
> [log in to unmask]
> 
> 
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