Jim,
We had a similar problem  (with a different brand of dry film) many years 
ago. After changing or tweaking most everything in sight, including dry 
film, wet processes and dry processes, what we found was that  our  inline 
rinse following (sodium carbonate) development  was incomplete, and the 
developing action continued on the sidewalls of the resist after the panels 
were through the machine and back in the racks.  The resist then "failed" on 
the pattern plating line. We fixed the problem by adding a recirculating 
sump containing a weak acid ( 1 or 2% acetic)  which acted as a stop bath 
for the developer.  The process became develop - rinse - stop - rinse. 
Thinking back, once we knew what kind of problem we had, we could even feel 
the "slimy" nature of the caustic on the surface of the resist. Since then, 
we have replaced our old  modular horizontal machine with a  vertical 
machine  and the problem has not recurred. The new machine has neither a 
heated rinse nor a stop bath, but we did have the manufacturer install 
larger pumps in both the process chamber and the recirculating rinse 
chamber.
Good Luck!

Mike Matson
Woodward Governor Company
Fort Collins, CO
[log in to unmask]
 ----------
From: TechNet-request
To: TechNet
Subject: Dry Film Breakdown
Date: Friday, September 13, 1996 8:24AM

We are experiencing sporadic dry film breakdown using Dynachem HG 2 mil
film. The laminators have
been thoroughly checked out so we don't suspect them and. The problem we are
seeing is what looks
like a seeping under the film in copper plating. When the panels are
completed the traces are
somewhat irregular and not as crisp edged as normal. What is frustraing is
that this happens so
sporadically and may only affect a couple of panels out of a long run or all
panels in a short run.

Any suggestions would be greatly appreciated.

Jim Moritz
ES&D

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