Jim, We had a similar problem (with a different brand of dry film) many years ago. After changing or tweaking most everything in sight, including dry film, wet processes and dry processes, what we found was that our inline rinse following (sodium carbonate) development was incomplete, and the developing action continued on the sidewalls of the resist after the panels were through the machine and back in the racks. The resist then "failed" on the pattern plating line. We fixed the problem by adding a recirculating sump containing a weak acid ( 1 or 2% acetic) which acted as a stop bath for the developer. The process became develop - rinse - stop - rinse. Thinking back, once we knew what kind of problem we had, we could even feel the "slimy" nature of the caustic on the surface of the resist. Since then, we have replaced our old modular horizontal machine with a vertical machine and the problem has not recurred. The new machine has neither a heated rinse nor a stop bath, but we did have the manufacturer install larger pumps in both the process chamber and the recirculating rinse chamber. Good Luck! Mike Matson Woodward Governor Company Fort Collins, CO [log in to unmask] ---------- From: TechNet-request To: TechNet Subject: Dry Film Breakdown Date: Friday, September 13, 1996 8:24AM We are experiencing sporadic dry film breakdown using Dynachem HG 2 mil film. The laminators have been thoroughly checked out so we don't suspect them and. The problem we are seeing is what looks like a seeping under the film in copper plating. When the panels are completed the traces are somewhat irregular and not as crisp edged as normal. What is frustraing is that this happens so sporadically and may only affect a couple of panels out of a long run or all panels in a short run. Any suggestions would be greatly appreciated. Jim Moritz ES&D *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************