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Subject:
Re: re-filling vias with RESIN
From:
"sbryan" <[log in to unmask]>
Date:
Mon, 26 Aug 96 07:28:13 PST
Content-Type:
text/plain
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text/plain (55 lines) 
     
Dougal,

     I am interested in both.  Can you give me more information regarding the 
copper filling process.

[log in to unmask]

______________________________ Reply Separator _________________________________
Subject: re-filling vias with RESIN
Author:  [log in to unmask] at corp
Date:    8/23/96 11:19 AM


> DATE:       23 August 1996
>   SUBJECT:    re-filling vias with RESIN 
>   REFERENCE:  question previously
>
>    I believe someone was looking for a way to completely fill vias 
>    with RESIN (not the sequential blind via type).
>
>    For whoever was interested, there is a company in France called
>    LAPE who are subcontractors for pcb fabrication processes including 
>    soldermask, HASL etc processes. One of the processes that they
>    offer is via hole injection filling, where they use a CNC
>    controlled, syringe injection system for filling holes with resin. 
>
>    More details from LAPE on +33 (1) 60 86 51 83 or 
>                          fax +33 (1) 60 86 51 80
>
>
>    Dougal Stewart
>    Product development manager
>    Exacta Circuits
>    Scotland
Component Intertechnologies can fill vias with copper using a forming 
process. If this is of any interest please contact me.
     
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