The following questionaire was drafted by the IPC 5-21c Component 
Process Compatability TAsk Group, Chaired By Lon Smith of Lucent. In 
order to support the writing of the specifications which are in draft 
stages, they require additional data on thermal profiling during PWB 
manufacture (i.e., input on what temps. and times boards are currently 
exposed to throughout the industry).  The data and sources 
will not be published individually.  In fact, name & company are optional.

Preferred: Fill out electronic form and return email to [log in to unmask]

Optional:  Print out questionaire and fax to Doug Sandvick, IPC 
847/509-9798.

Also, feel free to forward to non-technet colleagues.

If you have any questions pertaining to the questionnaire's language or 
intent, please call Jim Whitehouse at Plexus 414/751-5506 (also his email 
is in Cc: at top)

We hope to have some responses to review by our Tempe, AZ meeting on Jan. 
13.   

Finally, if you are interested in this area and wish to become active in 
this committee, please call me 847/509-9700 x 393.


Thank you for taking the time to help us with this important effort!

Doug Sandvick,
IPC Technical Project Manager

___________________________________________________________________________
         
            Reflow Solder Thermal Profiling Questionnaire


What type of reflow equipment do you use?
( )IR  ( ) IR/Convection  ( ) Forced Air Convection ( ) Vapor Phase

Do you perform thermal profiling of PCB assemblies through
your reflow machines?
          ( )Yes               ( )No

Do you feel it is important to perform thermal profiling of
PCB assemblies through your reflow machines?
          ( )Yes              ( )No

What component types do you reflow? (check all that apply)
( )Passives   ( )Actives   ( )Connectors  ( )BGAs  ( )Through Hole Components

At what locations do you attach thermocouples?
( )Board Surface   ( )Component Lead   ( )Component Body

How often do you perform thermal profiling on assemblies?
( )Hourly  ( )Daily  ( )First of Each Run  ( )Initial Pilot Run ( )As Needed

How much of a temperature variation do you see from one side
of the assembly to the other?




Do you monitor preheat slope?  If yes, what limits do you
use?
     ( )Yes - Limits:________________________ ( )NO

Do you monitor preheat dwell (soak period)? If yes, what
limits do you use?
     ( )Yes - Limits:_______________________ ( )No

Do you monitor liquidus period. If yes, what limits do you
use?
     ( )Yes - Limits:_______________________ ( )No

Do you monitor overall maximum temp?  If yes, what limits do
you use?
     ( )Yes - Limits:_______________________ ( )No

How were these limits derived?
( )Customer Requirements  ( )Component Requirements  ( )Chemistry Requirements

( )Industry Spec   ( )IPC Component Qualification Spec     ( )Other

Do you find any of these limits difficult to meet?  If yes,
note which ones.

(  )Yes  Which:
(  )No

What do you feel should be an acceptable limit?





Name: 
Company:
(Both optional)      






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