TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
[log in to unmask] (Brian R Oatman)
Date:
Fri, 26 Jan 1996 11:38:13 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (36 lines)
We offer GRADE 3 HTE 4% min as standard copper on our laminate available at 
no extra charge.



Brian R Oatman                        Tel- 503.357.8695 x 118
Manufacturing/Product Engineer        Fax- 503.357.8868
Matsushita Electronic Materials       E-mail- [log in to unmask]
Forest Grove, OR
"If you don't know what you're doing anything is possible."



>We are the design agent and user of printed circuit boards. Just recently 
>one of our board suppliers requested a material change 
>from: 	Rolled & Annealed Copper {IPC-MF-150, GR 7} on both sides 	of 
>0.031" FR-4 Laminate.
>
>to: 	Electrodeposited Copper {IPC-MF-150, GR 1} on both sides 	of 0.031" 
>FR-4 Laminate.
> 	
>			OR
>
>	Electrodeposited HTE Copper {IPC-MF-150, GR 3} on both 	sides of 0.031" 
>FR-4 Laminate.
>
>My question is which of the above material configurations is the most 
>available and the most cost efficient.
>
>Thank You One And All
>
>
>



ATOM RSS1 RSS2