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1996

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Subject:
ASSY: Solder Paste Volume
From:
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Date:
Wed, 30 Oct 1996 08:45:28 -0600
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     Address,
     
     Is anyone applying solderpaste to PCBAs with an aperture to stencil 
     ratio of 1.33?  I have some .012 pitch QFPs with random opens.  The 
     problem is either related to the device handling (bent leads that are 
     not visual or automatically inspected prior to assy) in the wafer 
     prior to pick and place or the soldepaste volume on the land.  Past 
     rules have been to have a ratio of 1.6 or greater, does this still 
     apply?  Has anyone used Dryfilm S/M versus LPI to increase solderpaste 
     volume on the lands?
     
     Please advise.
     

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