Address, Is anyone applying solderpaste to PCBAs with an aperture to stencil ratio of 1.33? I have some .012 pitch QFPs with random opens. The problem is either related to the device handling (bent leads that are not visual or automatically inspected prior to assy) in the wafer prior to pick and place or the soldepaste volume on the land. Past rules have been to have a ratio of 1.6 or greater, does this still apply? Has anyone used Dryfilm S/M versus LPI to increase solderpaste volume on the lands? Please advise. *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************