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1996

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Subject:
RE: Thermal Conductivity of Soldermask
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Date:
Tue, 19 Nov 1996 11:23:00 -0500 (EST)
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (30 lines) 
I don't know the thermal characteristics of solder mask, but leaving the ground 
plane under the device unmasked will definitely help. You will need intimate 
contact, though.  Since air is a very poor conductor, a mil of air gap might as 
well be a mile.  You might need a thermal adhesive underneath to help dissipate 
the heat.

Jim Marsico
(516) 595-5879
[log in to unmask]
		
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