We are experiencing a problem with SMT assembly of CBGA modules onto Entek
boards.  On about 1% of the boards (a significant number at our volumes),
solder from one or more of the pads does not wet the pad during reflow but
wicks up onto the ball, creating an open.  The defects appear to be randomly
located and are only noticeable when we use no-clean solder paste.  Previous
studies have indicated that our oven profile is not the problem.

Does anyone have experience with this kind of problem?  Any ideas would be
greatly appreciated.


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