TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Magee, Andrew P" <"andrew.p.magee"@rogers-corp.com>
Date:
Tue, 29 Oct 1996 08:39:00 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
     The companion computer program for a paper we presented 
     (Analysis of Flex Circuit Physical Characteristics) last 
     week at Flexcon '96 is now available on our homepage:
     
     http://www.rogers-corp.com/cmu
     
     It provides a simple way to do comparative analysis of 
     various flex circuit constructions for:
     
     Stress/Strain Relationships
     Positioning the Neutral Axis
     Determining the Moment of Inertia and Bias Forces
     Heat Flow Properties
     Thermal/Hygroscopic X-Y & Z Axis Expansion Estimates
     
     Andy Magee - Applications Engineer
     Rogers - Circuit Materials
     Tel: (602) 917-5237
     Fax: (602) 917-5256
     E-mail: [log in to unmask]
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2