My company is in the process of evaluating the use of Electroless 
     Nickel - Immersion Gold as a finish, for both SMT and mixed technology 
     PWBs.  Is this a good plating system to evaluate??  Is there any 
     "conventional wisdom" that we're missing?
     
     Secondly, some questions about the gold deposition.
     1. Is "electroless gold" the same as "immersion gold?"
     2. How thick can we expect the gold to deposit?
     3. Is the gold deposition process a self limiting one?
     4. How much gold is required to adequately keep the nickel solderable?
     
     Any other comments regarding this topic is appreciated.

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