DDrake asked:

>     We have a vendor that is having trouble securing components during a
>     wave soldering operation(as the board passes over the solder wave). On
>     DIP through-hole DIP packages they can not clinch the pads due to
>     trace proximities inherent on the board lay-out.

Is it absolutely necessary to do so? On common DIP parts inserted by hand,
I have never done so. If the machine used to insert them is clinching them
in such a way as to caue a problem, then change the cutter base or other
mechanism to reduce the bend angle, or stop clinching them altogether. This
would of course mean that handling after insertion and before soldering
must be done with more caution.

Even when I ran an old Amistar or Dynapert DIP inserter, I always thought
that the cut/clinch operation was more trouble than it was worth. Lead
clippings, damaged boards, mechanical wear and adjustment of the cutter
heads, etc. was a difficult maintenance area on that type equipment.

Other than handling benefits, IMO clinching DIP's is unnecessary in any
wave solder operation I ever saw.

I would assume you have some special case here which demands the clinching
or temporary securing of the parts?

>     Is anybody familiar with methods (fixturing, water-soluble adhesives,
>     etc,) that can be used for securing components aside from lead
>     clinching?

At one company I worked for, there was some bizarre vacuum-plastic film
heat shrink type thing which could do what you seem to want. By the time I
started there, it was already back in the corner with stuff shoved around
it so that the managers would forget about it.

There are of course heat curable epoxies (I prefer the Hereaus material)
which could be dispensed prior to insertion with an Asymtek machine, or
printed with a stencil. In order to cure the adhesive, you'd need a pretty
stout bake.

gluck

Jerry Cupples
Interphase Corporation
Dallas, TX
http://www.iphase.com