TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
[log in to unmask] (Thole, Lothar)
Date:
Wed, 06 Nov 1996 16:10 WAT
Content-Type:
text/plain
Parts/Attachments:
text/plain (35 lines)
Greg Bartlett of Mercury Computer Systems wrote:

<stuff deleted>

For what it's worth:  our products are generally double-sided SMT or 
mixed =
technology, they're assembled with water soluble chemistries, and the =
final applications are mainly in high performance defense and medical =
markets.

<stuff deleted>

My question is: When using OSPs with mixed technology, how is the issue 
of hole fill and top-side wetting of the annular rings addressed?

Regards,
Lothar Thole
QPSX Communications Pty Ltd
33 Richardson Street
West Perth  WA  6005  Australia
Tel: +61-9-262-2000
Fax: +61-9-324-1642
email: [log in to unmask]



***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2