Chris-
     
     Sonoscan is known for its acoustic microscopy imaging systems, which 
     are useful for examining plastic encapsulated semiconductor packages 
     for voids, delamination, etc., due to "popcorning" damage, die bond 
     failures, etc.
     
     Per NEPCON West '96 Buyers Guide:
     
     Sonoscan, Inc.
     530 East Green Street
     Bensenville, IL 60106
     708-766-7088
     
     I have a paper which describes the principle of operation and the 
     application of Sonoscan "C-SAM" equipment, "An Evaluation of Acoustic 
     Microscopy (for nondestructive inspection of PEMs, MCMs, etc.)", by 
     Allen Hawes of the Naval Surface Warfare Center at Crane, presented at 
     the 1995 Advanced Technology, Acquisition, Qualification, and 
     Reliability Workshop here in Southern California last August. Contact 
     me if you want a copy faxed to you.
     
     Also, the cover story on SMT Magazine, May 1995, discusses SAM in the 
     assessment of popcorning on plastic QFP.
     
     Regards,
     
     Michael S. Alderete
     Sr. R & D Engineer
     Lockheed Martin (formerly Loral), Aeronutronic Division
     29947 Avenida De Las Banderas
     Rancho Santa Margarita, CA 92688
     
     (714)459-3190FAX
     
     email: [log in to unmask]
     


______________________________ Reply Separator _________________________________
Subject: Re:Sonascan
Author:  [log in to unmask] at _internet
Date:    4/24/96 2:48 PM


Hello, 
     
I am looking for any information available on a technology available 
called, "Sonascan".  It is a type of inspection for Ball Grid Arrays 
(BGAs).  Any information at all would be appreciated...
     
Thank You, 
C. Piasky
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