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Date: | 21 Feb 1996 11:13:56 -0800 |
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Subject: Time: 10:38 AM
OFFICE MEMO FWD>RE>IPC spec IPC-A-600D Corrected Date: 2/21/96
Sincere apologies to all -- I did a major bo bo in the first sending of this
response, I should have QA'd (re-read) my message before I sent it. In the
original response, I crossed the acceptance requirements for Class 1 and Class
3, The following (hopefully) does not contain these errors.
-- Ralph
To: [log in to unmask]
You inquiried, "We are wondering what is the latest rev of this
spec(IPC-A-600D). We have one dated 9-25-89. Specifically we are questioning
allowable plating voids in through holes. Are circumferential voids
acceptable in current spec?
Response follows:
Steve, the A-600 revision "E" was released about Sept '95.
The "E" rev. has two acceptance conditions for voids in the plated-through
hole and is based on the IPC-RB-276 paragraph 3.6.3:
1 - One set of conditions is where the void extends through all metal coatings
and exposes the printed board base material.
Class 1 products, 3 voids, with no void greater than 10% of the hole
length in any direction.
Class 2 products, 1 void, with the size of the void less than 5% of the
hole length in any direction.
Class 3 products, no voids allowed.
All classes, there shall be no circumferential voids greater than 90
degrees.
2 - Second set of conditions is where the void is in the finish or over
coating and does not penetrate into the primary current carrying
plated-through hole material.
Class 1, five voids with no more than 15% of the holes in the printed
board with voids.
Class 2, three voids with no more than 5% of the holes in the printed
board with voids.
Class 3, one void, with no more than 5% of the holes in the printed board
with voids.
This should answer you query, if not please feel free to contact me.
Ralph Hersey
Lawrence Livermore National Laboratory
Phn: 510.422.7430
FAX: 510.424.6886
e-mail: [log in to unmask]
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