Subject: Time: 10:38 AM OFFICE MEMO FWD>RE>IPC spec IPC-A-600D Corrected Date: 2/21/96 Sincere apologies to all -- I did a major bo bo in the first sending of this response, I should have QA'd (re-read) my message before I sent it. In the original response, I crossed the acceptance requirements for Class 1 and Class 3, The following (hopefully) does not contain these errors. -- Ralph To: [log in to unmask] You inquiried, "We are wondering what is the latest rev of this spec(IPC-A-600D). We have one dated 9-25-89. Specifically we are questioning allowable plating voids in through holes. Are circumferential voids acceptable in current spec? Response follows: Steve, the A-600 revision "E" was released about Sept '95. The "E" rev. has two acceptance conditions for voids in the plated-through hole and is based on the IPC-RB-276 paragraph 3.6.3: 1 - One set of conditions is where the void extends through all metal coatings and exposes the printed board base material. Class 1 products, 3 voids, with no void greater than 10% of the hole length in any direction. Class 2 products, 1 void, with the size of the void less than 5% of the hole length in any direction. Class 3 products, no voids allowed. All classes, there shall be no circumferential voids greater than 90 degrees. 2 - Second set of conditions is where the void is in the finish or over coating and does not penetrate into the primary current carrying plated-through hole material. Class 1, five voids with no more than 15% of the holes in the printed board with voids. Class 2, three voids with no more than 5% of the holes in the printed board with voids. Class 3, one void, with no more than 5% of the holes in the printed board with voids. This should answer you query, if not please feel free to contact me. Ralph Hersey Lawrence Livermore National Laboratory Phn: 510.422.7430 FAX: 510.424.6886 e-mail: [log in to unmask]