We recently pruchaced an IR Pyrometer primarily for the 
measurement of DF lamination roll and panel exit temperatures.  
As we can adjust the emissivity setting on the instrument I would 
appreciate anyone's experience on emissivity settings when 
measuring panel exit temps.  Does the adjustsment change when 
measuring scrubbed vs. unscrubbed copper?

On another subject, thanks for all the replys on the DF adhesion 
problems that I posted.  The problem still persists somewhat, but 
has been greatly reduced.


Dave Rosato
SAE Circuits Colorado, Inc.
(303)530-1900

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