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| Date: | Mon, 15 Jul 1996 10:22:42 -0600 |
| Content-Type: | text/plain |
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IPC-TM-650 Method 2.4.36 Rework Simulation, Plated Through Hole calls
for unsoldering and resoldering a wire in a plated through hole 5 tiimes
using a 60 w. soldering iron set at 450 to 500 deg. F. This soldering iron
temperature requirement seems very low to me and doesn't fit actual
practice in industry. Is there something I'm missing? Does anyone know
why the temperature is required to be at 450 to 500 F?
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