TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Pucket, Larry Lee 9784 M" <[log in to unmask]>
Date:
19 Jun 1996 12:00:00 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
What are the problems with running the soldermask to the edge of the printed 
wiring board and non-plated holes?  We have been keeping it away by 50 mils 
but you see alot of commercial boards with it to the edge.

Does it depend on board material?  Does it depend on whether it is 
commercial versus military?  Does it depend on dry versus liquid soldermask?

Any ideas would be appreciated.

Larry L. Pucket
Dept. 9784 MS0624
Sandia National Laboratories
P.O. Box 5800
Albuquerque, NM 87185-0624

Phone: (505)844-1711
  Fax: (505)844-7428

Email: [log in to unmask]



ATOM RSS1 RSS2