Good Morning TechNet!
     
     Your method of conducting a solderability test should not change just 
     because you are not using a tin/lead finish! I suggest using one of 
     the tests in ANSIJ-STD-003. With the emergence of the new alternative 
     finishes (e.g. gold, silver, palladium) the specifications are still 
     playing catch-up but the basic test methods are still applicable. You 
     may need to change a dwell time because of dissolution rates (e.g. 
     palladium) or may want to use a different flux because of your process 
     (e.g. OSP type finishes) - work with your pwb vendor to have an 
     acceptable test procedure both groups can use. I only have one 
     reference in my pile of papers that discusses the relationship of 
     solderability and E nickel but it's pretty good. Try:
     
     "Factors Influencing Solderability Of Electroless Ni-P Deposits", Jing 
     Fang, Plating & Surface Finishing, pages 44-47, July 1992. 
     
     Good Luck
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]
     
     
     


______________________________ Reply Separator _________________________________
Subject: solderability test for ENIG PCB finish
Author:  [log in to unmask] at ccmgw1
Date:    12/13/96 10:44 PM


Dear Technetters,
     
 What is a quick, easy & effective way of assessing
solderability/ wettability of a PCB with electroless nickel/immersion gold 
(ENIG) finish? How does phosphorus content in the Ni deposits affect 
solderability? Will a lower %P content in Ni be more prone to 
passivation/oxidation & thus affecting solderability??
     
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