Good Morning TechNet! Your method of conducting a solderability test should not change just because you are not using a tin/lead finish! I suggest using one of the tests in ANSIJ-STD-003. With the emergence of the new alternative finishes (e.g. gold, silver, palladium) the specifications are still playing catch-up but the basic test methods are still applicable. You may need to change a dwell time because of dissolution rates (e.g. palladium) or may want to use a different flux because of your process (e.g. OSP type finishes) - work with your pwb vendor to have an acceptable test procedure both groups can use. I only have one reference in my pile of papers that discusses the relationship of solderability and E nickel but it's pretty good. Try: "Factors Influencing Solderability Of Electroless Ni-P Deposits", Jing Fang, Plating & Surface Finishing, pages 44-47, July 1992. Good Luck Dave Hillman Rockwell Collins [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: solderability test for ENIG PCB finish Author: [log in to unmask] at ccmgw1 Date: 12/13/96 10:44 PM Dear Technetters, What is a quick, easy & effective way of assessing solderability/ wettability of a PCB with electroless nickel/immersion gold (ENIG) finish? How does phosphorus content in the Ni deposits affect solderability? Will a lower %P content in Ni be more prone to passivation/oxidation & thus affecting solderability?? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************