Typically when LPI is used to tent vias, one side of the board will seal 
and the other may have pin holes or openings in the mask that covers the 
via.  This creates a copper lined cup capable of trapping any subsequent 
chemistry liquids that it may be exposed to (fluxes, cleaners, etc.).
     Is this concern reduced when nickel/gold are plated over the entire 
copper board?
     Please share your via tenting experiences.  Thanks.

     Norm Dill
     RF Communications
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