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| Date: | Wed, 7 Aug 96 09:33:05 EDT |
| Content-Type: | text/plain |
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Eugenio,
MCM stands for Multi Chip Module which is a high density packaging and
interconnect approach. the -L and -C stand for the type of substrate. I
believe -L is organic, -C is non-organic.
IPC-MC-790 Guidelines for MultiChip Module Technology Utilization is a good
place to start.
Jeff
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