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Subject:	RE: Dry Film Resist Test
From:	"Bob Oliver, Jr" <[log in to unmask]>
Date:	Thu, 11 Jul 1996 15:31:27 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (36 lines)

1.  Check copper cleaning (surface prep) of panels to be laminated
2.  Check roll temperature of laminator (230 deg F) and exit temperature of the laminated panel (120 deg F).  These are the two usual causes of resist lifting.
3.  Make sure acid cleaner is compatible to the resist.

------------------------------------------------------------------------------------------------
Ed Wright	Technical Support 
Oliver Sales Company 	Phone:  (214) 231-1522
13445 Floyd Circle 	Fax:  (214) 644-3585
Dallas, Texas  75243-1595 	E-mail:  [log in to unmask]
------------------------------------------------------------------------------------------------

----------
From:  Jim Moritz[SMTP:[log in to unmask]]
Sent:  Tuesday, July 09, 1996 6:31 AM
To:  [log in to unmask]
Subject:  Dry Film Resist Test

(I placed this question a few days ago but received an eror message saying it only went to a couple addresses)
We are looking for any testing that can be done after developing of dry film resist. At present we do not have a feed and bleed system. We are using soda ash for developer in a Chemcut 547. Resist is Morton(Dynachem) HG 2 mil.
We are trying to rule out imaging and developing as a problem cropping up after etch that looks like dry film breakdown. We are pretty sure the breakdown is happening somewhere along the plating line but as many of you know how platers can be, we must rule out all other possibilities first. All other processes in the imaging department can be calibrated and tested with the exception of the developed dry film resist.
Any help is greatly appreciated.

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