What is the proper storage of SMT ICs;  are there any guidelines or 
     standards to use?  If moisture absorption is a problem with plastic 
     parts, is the standard practice to bake assemblies or parts prior to 
     reflow?  What are the baking requirements?  
     
      Our in-house stores personnel won't break down the sealed outer packs 
      as supplied by the IC manufacturers (they'll issue ICs in quantities 
     as supplied by the IC manufacturers, approx.  100 or 200 parts each).  
     As a result we have opened partial packs of parts remaining in the 
     manufacturing area.  Thanks.

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