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| From [log in to unmask] Thu Nov 14 10: |
35:45 1996 |
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Fri, 8 Nov 1996 17:02:49 -0600 |
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What is the proper storage of SMT ICs; are there any guidelines or
standards to use? If moisture absorption is a problem with plastic
parts, is the standard practice to bake assemblies or parts prior to
reflow? What are the baking requirements?
Our in-house stores personnel won't break down the sealed outer packs
as supplied by the IC manufacturers (they'll issue ICs in quantities
as supplied by the IC manufacturers, approx. 100 or 200 parts each).
As a result we have opened partial packs of parts remaining in the
manufacturing area. Thanks.
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