could you please send more information on the CD Roms and training 
     material
     thanks
     gloria
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: ASSY: CD ROM Training in SMT
Author:  [log in to unmask] at OUT
Date:    6/2/96 5:01 AM


Here are details of some of the latest training material I have been producing 
in the UK which should be available in June. The defect photo album may be of 
interest to people wanting to produce there own training material or standards.
     
Bob Willis Surface Mount Process Defect Guide
     
The first CD ROM provides a guide to common process defects found at each stage 
of the SMT process. It also includes defects specifically on printed boards and 
components. At the first screen you select the process you want to view which 
gives you an introduction to the processes listed below.
     
Printed Boards, Components inc; BGA, Screen Print, Adhesive Application, 
Placement, Reflow Solder, Wave Solder, Cleaning, Rework
     
In the case of printed board section it explains the most important issues with 
surface mount circuits. It then lists common process defects which can be 
selected to reveal a photographic example of the defect type and an explanation 
of the possible causes.
     
This disk will form part of the forthcoming Bob Willis Master Class Series
     
     
Surface Mount Process Defects Photo Album
     
This CD ROM provides the process or quality engineer with a source of 
photographs of process defects which may be used in company inspection document 
or presentations. They may be simply pasted into any document for in house 
company use. Each photograph is provided as a .Tiff file format
     
The disk includes examples of the following:
     
Chip Leaching,  Poor Solderability,  Plastic Cracking, BGA Misplacement,  BGA 
Cracking,  BGA Cracking, Capacitor Cracking,  Plastic Softening, QFP Cracking, 
Solder Beading, Crystallised Joints,  Cracked Joint, Poor Pad Wetting, Component
Lift,  No Wetting,  Joint Failure,  Joint Voiding,  Solder Wicking,  Component 
Lifting,  Solder Short,  Non Reflow,  PCB Measeling,  Poor Penetration,  Solder 
Skip,  Bulbous Joint,  Blow Hole,  Solder Webbing, Adhesive Contamination, 
Adhesive Stringing,  Excess Adhesive,  Misplaced Lead,  Misplaced Component, 
Dendrite Growth,  Corrosion,  Solder Spikes,  Flux Residues,  Joint Cracking, 
Pad Lifting.
     
Surface Mount Inspection Standards
     
The CD ROM provides a simple tutorial on inspection of surface mount assemblies.
It covers adhesive application, placement and soldering. The four main 
termination's are covered, chip, gull wing, J Lead and castillation. The 
criteria is given with each example which is in line with the current European 
and IPC standards.
     
Also included on the CD ROM is an inspection standard which can be modified or 
printed out with illustrations for a company training document or inspection 
standard.
     
     
Conventional Soldering Standards
     
The CD ROM provides a simple tutorial on inspection of conventional assemblies. 
It covers  lead length, lead clench and soldering of components and wire 
termination's. Single sided, double sided boards are illustrated. The criteria 
is given for each example which is in line with the current European and IPC 
standards.
     
Also included on the CD ROM is a inspection standard which can be modified or 
printed out with illustrations for a company training document or inspection 
standard.
     
Bob Willis
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England. 
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/bwillis 
Email: [log in to unmask]