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1996

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Subject:
DES Solder lands 2
From:
[log in to unmask] (Guenter Grossmann)
Date:
Wed, 8 May 1996 12:31:54 +0200
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Garry

Thank you very much for your hint. I do work with IPC-SM-782A but I thought
that this spec. only applies to components with wettable terminations
touching the solder wave. Are you sure I can use it also for components
with terminations that are so small that the wave has to touch the solder
land in order to form a solder joint?

Best regards

Guenter

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