Is there an IPC void size specification for PBGA's detected by 
     transmission X-ray (we use Nicolett Systems).
     
     Our current guideline is- voids are acceptable only if they are 
     smaller than 20% of the diameter of the solder ball.  What is your 
     criteria for acceptability?
     
     Do you have reliability data to support your specification? Has there 
     been any published papers specifically on the effects of voids on the 
     reliability of PBGA solder joints?
     
     Sincerely,
     Eric Fremd
     Process Developement Engineer
     Solectron Technical Center
     (408) 956-6194
     [log in to unmask]

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