I received the attached note this week, and thought some of you
"technetters" might be interested in knowing about this. I am familiar with
this group. Their objectives are to bring OEMs and suppliers together to try
to develop needed infrastructure for future package types.
>
>Workshop to Enhance Relations Between Packaging Users and Suppliers
>Co-sponsored by: SEMI, and HDP User Group International
>Endorsed by: ISHM and MCM Division of EIA
>
>
>SEMI Event #S6WER
>
>Date: Wednesday, October 16
>Time: 1:30 pm - 5:30 pm
>Location: Austin Convention Center, Austin, Texas, USA
>
>Registration Fee:
>Before September 16
>$125:00 Discounted SEMI/HDP User Group Member Price: $95:00
>After September 16 $195:00
>
>Registration contact Yanic Fridman, SEMI
>E-mail: [log in to unmask]
>Phone: USA 415 940 6996
>Fax: USA 415 940 7943
>
>
>ABSTRACT
>
>This workshop focuses on the implementation of enhanced user-supplier
>relations as it applies to packaging reliability
>characterization/qualification. A new, more efficient, user-supplier
>"handshaking" procedure for qualification of packaging will be presented.
>The procedure creates win-win situations between users and suppliers and
>brings benefits for both users and suppliers when implemented.
>
>Users present a Telecom companies common definition of use environments
>which will facilitate the second level packaging reliability
>characterization to be done by suppliers. Suppliers support of the new, more
>efficient, user-supplier "handshaking" procedure for qualification of
>packaging will also be presented.
>
>A panel discussion will finally be held aimed at demonstrating the interest
>in the new procedures for strengthening user-supplier partnership in
>packaging component to board qualification.
>
>Who Should Attend: System integrators, device manufacturers, package
>fabricators and designers, contract manufacturers and equipment, materials,
>and process suppliers.
>
>
>AGENDA
>
>1 Opening remarks - The importance of user supplier communications in
>incorporating new high density packaging in system designs.
> - Stan Xavier, Nortel
>
>2 Operating idea of HDP User Group
> - Ruben Bergman, HDP User Group
>
>3 Common Framework for device characterizations - Telecom Common
>Requirement on package to board reliability, User/Supplier Collaboration
> - Monica Bakszt, Ericsson
>
>4 Real life experience of BGA:s
> User and supplier know how
> - ASAT
> - Ericsson
> - Nokia
> - Nortel
> - SGS Thomson
>
>5 Panel discussion: Lessons learned - Advantages of collaborative approach.
>(users and suppliers that participated give their view of this process, What
>advantages they see. What problems they see. There ideas on user supplier
>relationship in HDP application.)
>
>ASAT, Ericsson, Nokia, Nortel, SGS Thomson
>(each 10 minutes, questions to panel 20 minutes )
>
>Break
>
>6 Telecom Use Environment Guideline - An example of one way to communicate
>needs to
>suppliers
> - Dave Kiang, Nortel
>
>7 Wrap up comments
>
>Ruben Bergman
>HDP User Group International Inc
>[log in to unmask]
>
>
>
Ron Gedney
[log in to unmask]
Integrated Electronic Eng. Center
Watson School of Eng. & Applied Science
Binghamton University
P.O. Box 6000
Binghamton, NY 13902
607-777-4335, fax 4683
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