I doubt you could screen 163-4 from Ablebond. Check with them but I think the
rheology will be all wrong. 
Basically you need a highly thixotropicand cohesive material. SMT adhesive or a
silver conductive material as used for solder replaement would do. If you
screen/stencil this rather like in intrusive paste reflow it should wet into the
hole and cure there. Adjust screenstencil thick to give appropriate volume,
which you can caluclate easily enough (Pi rsquared and all that stuff).
Check compatibility of surfaces as well whilst speakingwith Ablestik - epoxy
materials don't bond very well to tin or tin containing surfaces (eg solder).
As if not more importantly 163-4  work life is only around 45 minutes, this does
not give you very long to set up and print before you will have to remove the
material and junk it.
I guess the idea is that it is a cheap(compared to silver filled) conductive
material, but unless you print an awful lot of assemblies very rapidly you will
loose any price economies in material wastage and clean up time. You might
consider dispense as you could pick a syringe size to keep within the limited
work life. 

Mike Fenner
BSP (UK)
Tel: +441 295 720631
Fax::+441 295 720 937

---------------------------------------------------------------------------------
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From: [log in to unmask]
Message-Id: <[log in to unmask]>
Subject: via hole filling with epoxy (ablebond)

does anyone have any information on how to apply Ablebond 163-4n 
copper filled epoxy into via holes by means of screening or stencil? 
this is the liquid epoxy type. need any suggestions or info i can 
get. thank you.

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