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| Date: | Sat, 10 Feb 96 11:43:00 MST |
| Content-Type: | text/plain |
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Hello
I guess I should have stated that this design has just thru-hole vias, no
B/B vias. And that this is what I have interpreted the section D to look
like : (just the top half of centerline)
<---1--o ---14--o o--14--o o--14--o o--1--o o--1--o
o--1--o o--1--o
| | | | |
| | | | | | | |
2 3 4 5 6 7
8 9 10 11 12 13 14
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| | | | | | | |
o-14-o o-14-o o-14-o o-1--o
o-1--o o-1--o o
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1
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o
(<--bottom half)
This has maintained the "interconnects. . . . . greatest extent possible" ,
but ?????
The number represent conductor layer between vias. The section ends up 1.925
mils
just for the required vias holes ??????
Once again ThankYou in
advance for any HELP ! ! !
DaveS
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