Hello
  I guess I should have stated that this design has just thru-hole vias, no 
B/B vias.  And that this is what I have interpreted the section D to look 
like :   (just the top half of centerline)


<---1--o ---14--o      o--14--o      o--14--o      o--1--o      o--1--o 
     o--1--o      o--1--o
                           |        |            |        |           | 
       |         |        |         |        |         |        |         |
                          2       3          4       5          6       7 
      8       9      10    11      12     13     14
                           |        |            |        |           | 
       |         |        |         |        |         |        |         |
                          o-14-o          o-14-o        o-14-o      o-1--o 
       o-1--o       o-1--o        o
                                                                              
                                                                       |
                                                                              
                                                                       1
                                                                              
                                                                       |
                                                                              
                                                                       o 
(<--bottom half)
This has maintained the "interconnects. . . . . greatest extent possible" , 
but ?????
The number represent conductor layer between vias. The section ends up 1.925 
mils
just for the required vias holes ??????
                                                   Once again  ThankYou in 
advance for any HELP ! ! !
                                                                              
  DaveS