Hello I guess I should have stated that this design has just thru-hole vias, no B/B vias. And that this is what I have interpreted the section D to look like : (just the top half of centerline) <---1--o ---14--o o--14--o o--14--o o--1--o o--1--o o--1--o o--1--o | | | | | | | | | | | | | 2 3 4 5 6 7 8 9 10 11 12 13 14 | | | | | | | | | | | | | o-14-o o-14-o o-14-o o-1--o o-1--o o-1--o o | 1 | o (<--bottom half) This has maintained the "interconnects. . . . . greatest extent possible" , but ????? The number represent conductor layer between vias. The section ends up 1.925 mils just for the required vias holes ?????? Once again ThankYou in advance for any HELP ! ! ! DaveS