I think you are looking for IPC-TR-579 "Round looking
Robin Reliability Evaluation of Small Diameter Plated Through Holes in 
PWBs"  This report had some comparison of Tg's as part of the data analysis.

You can order from IPC's customer service department on extension 348

Regards
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David W. Bergman, Technical Director
IPC
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On Fri, 23 Aug 1996, Scott B. Westheimer wrote:

> From: Scott Westheimer
> Date: 8/23/96
> Ref.: PCB Fabrication
> 
> I am looking for a paper that was done about 5 or 6 years ago. It covered a
> round robin test that was performed using different materials with
> different Tg's. The purpose of the test was to evaluate failures in the PTH
> during thermal cycling to determine what if any effect the Tg had on hole
> quality. Can someone either send this to me or direct me in the right
> direction.
> 
> Thanks
> 
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