TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Fri, 13 Dec 1996 10:56:41 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
Frank,
Please do NOT call silver, or any other surface finish 'highly solderable'.
Surface finishes are NOT soldered to; they certainly promote the flow of
solder across the surface that the surface finishes cover, but the surface
underneath the surface finish need to be solderable and wetted to. These
highly soluble (in tin) surface finishes (gold, silver, sometimes copper) are
very thin and go into solution with tin almost instantaneously. These surface
finishes can be dangerous, because they give the appearance of good wetting
whether or not good wetting has taken place. You can get good coverage this
way without good wetting to the base metal underneath.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2