Solderquick have designed a BGA re-balling kit which consists of a paper 
based carrier holding the new solder balls. This is attached to the PBGA 
to be re-balled with a clip type fixture, and then reflowed to attach the 
new balls to the device. The carrier is then softened by moistening it, 
and then removed.

The kits can be obtained from Winslow Automation Inc, Santa Clara at fax 
(408) 496-0381 attention Jennifer Cortez.

Lothar Thole
Senior Manager - Technical Operations
QPSX Communications Pty Ltd
33 Richardson Street
West Perth  WA  6005
Australia
Tel: +61-9-262-2000
Fax: +61-9-324-1642
email: [log in to unmask]



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