Here are details of some of the latest training material I have been producing
in the UK which should be available in June. The defect photo album may be of
interest to people wanting to produce there own training material or standards.

Bob Willis Surface Mount Process Defect Guide

The first CD ROM provides a guide to common process defects found at each stage
of the SMT process. It also includes defects specifically on printed boards and
components. At the first screen you select the process you want to view which
gives you an introduction to the processes listed below.

Printed Boards, Components inc; BGA, Screen Print, Adhesive Application,
Placement, Reflow Solder, Wave Solder, Cleaning, Rework

In the case of printed board section it explains the most important issues with
surface mount circuits. It then lists common process defects which can be
selected to reveal a photographic example of the defect type and an explanation
of the possible causes.

This disk will form part of the forthcoming Bob Willis Master Class Series


Surface Mount Process Defects Photo Album

This CD ROM provides the process or quality engineer with a source of
photographs of process defects which may be used in company inspection document
or presentations. They may be simply pasted into any document for in house
company use. Each photograph is provided as a .Tiff file format

The disk includes examples of the following:

Chip Leaching,  Poor Solderability,  Plastic Cracking, BGA Misplacement,  BGA
Cracking,  BGA Cracking, Capacitor Cracking,  Plastic Softening, QFP Cracking,
Solder Beading, Crystallised Joints,  Cracked Joint, Poor Pad Wetting, Component
Lift,  No Wetting,  Joint Failure,  Joint Voiding,  Solder Wicking,  Component
Lifting,  Solder Short,  Non Reflow,  PCB Measeling,  Poor Penetration,  Solder
Skip,  Bulbous Joint,  Blow Hole,  Solder Webbing, Adhesive Contamination,
Adhesive Stringing,  Excess Adhesive,  Misplaced Lead,  Misplaced Component,
Dendrite Growth,  Corrosion,  Solder Spikes,  Flux Residues,  Joint Cracking,
Pad Lifting.

Surface Mount Inspection Standards

The CD ROM provides a simple tutorial on inspection of surface mount assemblies.
It covers adhesive application, placement and soldering. The four main
termination's are covered, chip, gull wing, J Lead and castillation. The
criteria is given with each example which is in line with the current European
and IPC standards.

Also included on the CD ROM is an inspection standard which can be modified or
printed out with illustrations for a company training document or inspection
standard.


Conventional Soldering Standards

The CD ROM provides a simple tutorial on inspection of conventional assemblies.
It covers  lead length, lead clench and soldering of components and wire
termination's. Single sided, double sided boards are illustrated. The criteria
is given for each example which is in line with the current European and IPC
standards.

Also included on the CD ROM is a inspection standard which can be modified or
printed out with illustrations for a company training document or inspection
standard.

Bob Willis
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/bwillis
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